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Course Co-ordinated by IISc Bangalore
Prof. N. V Chalapathi Rao
IISC Bangalore


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Electronics Design is understood as analysis and implementation at various levels from large systems installation to chip design. One of the aspects is failure due to temperature effects is constantly under study. Theory of Heat transfer has been understood and explained way back in 1700. Rigor and precision has resulted in seemingly complicated ‘equations’.

In the design of enclosures, managing heat is (relatively) well understood. Empirical results can be used to optimise the layout and reduce failure. Practices in use of heat management hardware are available from specialist manufacturers and can be used. This course is an attempt to familiarise the participating registrants with heat related issues in Design of Electronic Product enclosures.




Introduction to Enclosures and thermal issues
Basics of conductive heat transfer
Radiation at normal ambient
Convection basics
Forced convection
Combined modes


Use of Conduction in enclosures
Radiation as a speciality
Convective cooling in small products
1Forced cooling in medium and large systems
Liquid cooled high power modules
Novelty phase change and thermo electrics
Refrigerated cabinets


Heat sinks practical application
Blowers, fans, ventilations of systems
Instrumentation for measurement
Effects on sealed enclosures


Integration of ID with the heat aspects
Case stories in biological instruments
Case study of select participants’ work
Application of Thermal CAD and round up

12th Standard

  • OCW, YouTube videos on related topics, Manufacturers documentation
  • ET Schonholzer -Thermal Design CEDT
  • Yunus Cengel, Afshin Ghajar - Heat and Mass Transfer: Fundamentals and Applications
  • Halliday, Resnick, Walker - Principles of Physics
  • Ralph Remzberg - Thermal Design CRC press
  • Pahl and Beitz - Engineering Design Springer
  • Product catalogues of Heat sinks, Blowers, coolers, Mounting hardware



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