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Course Co-ordinated by IISc Bangalore
Prof. G.V. Mahesh
IISc Bangalore


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The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging.

The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level.

The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered.


Topics and contents


I) Overview of electronic systems packaging

  1. Introduction and Objectives of the course

  2. Definition of a system and history of semiconductors

  3. Products and levels of packaging

  4. Packaging aspects of handheld products; Case studies in applications

  5. Case Study (continued); Definition of PWB, summary and Questions for review


II) Semiconductor Packaging Overview

  1. Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon”

  2. Wafer fabrication, inspection and testing

  3. Wafer packaging; Packaging evolution; Chip connection choices

  4. Wire bonding, TAB and flipchip-1

  5. Wire bonding, TAB and flipchip-2; Tutorials


III) Semiconductor Packages

  1. Why packaging? & Single chip packages or modules (SCM)

  2. Commonly used packages and advanced packages; Materials in packages

  3. Advances packages (continued); Thermal mismatch in packages; Current trends in packaging

  4. Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages


IV) Electrical Design considerations in systems packaging (L. Umanand)

  1. Electrical Issues – I; Resistive Parasitic

  2. Electrical Issues – II; Capacitive and Inductive Parasitic

  3. Electrical Issues – III; Layout guidelines and the Reflection problem

  4. Electrical Issues – IV; Interconnection


V) CAD for Printed Wiring Boards

  1. Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT

  2. Components of a CAD package and its highlights

  3. Design Flow considerations; Beginning a circuit design with schematic work and component layout

  4. Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability


VI) Printed Wiring Board Technologies: Board-level packaging aspects

  1. Review of CAD output files for PCB fabrication; Photo plotting and mask generation

  2. Process flow-chart; Vias; PWB substrates

  3. Substrates continued; Video highlights; Surface preparation

  4. Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs

  5. PWB etching; Resist stripping; Screen-printing technology

  6. Through-hole manufacture process steps; Panel and pattern plating methods

  7. Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias

  8. Microvia technology and Sequential build-up technology process flow for high-density interconnects

  9. Conventional Vs HDI technologies; Flexible circuits; Tutorial session


VII) Surface Mount Technology

  1. SMD benefits; Design issues; Introduction to soldering

  2. Reflow and Wave Soldering methods to attach SMDs

  3. Solders; Wetting of solders; Flux and its properties; Defects in wave soldering

  4. Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures

  5. SMT failure library and Tin Whiskers

  6. Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys

  7. Lead-free solder considerations; Green electronics; RoHS compliance and  e-waste recycling issues


VIII) Thermal Design considerations in systems packaging (L. Umanand)

  1. Thermal Design considerations in systems packaging


IX) Embedded Passives Technology

  1. Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes

  2. Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging


X) Conclusion and Summary

  1. Exclusive chapter wise summary

Electrical and Electronics; Mechanical, Chemical, Instrumentation, Chemistry, Physics, Materials Engineering, Industrial Engineering.

  1. Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.

  2. William D. Brown, Advanced Electronic Packaging, IEEE Press, 1999.

  3. Web-based Current literature.

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