Modules / Lectures
Module NameDownloadDescriptionDownload Size
Introduction to Micro and Smart SystemsLecture 1Lecture Notes1994 kb
Introduction to Micro and Smart SystemsLecture 2Lecture Notes11408 kb
Introduction to Micro and Smart SystemsLecture 3Lecture Notes2153 kb
Introduction to Micro and Smart SystemsLecture 4Lecture Notes11793 kb
Introduction to Micro and Smart SystemsLecture 5Lecture Notes5593 kb
Introduction to Micro and Smart SystemsLecture 6Lecture Notes33305 kb
Microfabrication processesLecture 7Lecture Notes1422 kb
Microfabrication processesLecture 8Lecture Notes6082 kb
Microfabrication processesLecture 9Lecture Notes6755 kb
Microfabrication processesLecture 10Lecture Notes4250 kb
Microfabrication processesLecture 11Lecture Notes1829 kb
Mechanics of Slender SolidsLecture 16Lecture Notes1188 kb
Mechanics of Slender SolidsLecture 18Lecture Notes1041 kb
Mechanics of Slender SolidsLecture 19Lecture Notes1128 kb
Mechanics of Slender SolidsLecture 20Lecture Notes2486 kb
Mechanics of Slender SolidsLecture 21Lecture Notes1676 kb
Mechanics of Slender SolidsLecture 22Lecture Notes1103 kb
Mechanics of Slender SolidsLecture 23Lecture Notes4365 kb
Mechanics of Slender SolidsLecture 24Lecture Notes6053 kb
Finite Element MethodLecture 25Lecture Notes4827 kb
Finite Element MethodLecture 26Lecture Notes19362 kb
Finite Element MethodLecture 27Lecture Notes424 kb
Finite Element MethodLecture 28Lecture Notes2254 kb
Finite Element MethodLecture 29Lecture Notes687 kb
Finite Element MethodLecture 30Lecture Notes2370 kb
Electronics and PackagingLecture 31Lecture Notes913 kb
Electronics and PackagingLecture 32Lecture Notes474 kb
Electronics and PackagingLecture 33Lecture Notes232 kb
Electronics and PackagingLecture 36Lecture Notes478 kb
Electronics and PackagingLecture 37Lecture Notes524 kb
Electronics and PackagingLecture 38Lecture Notes8623 kb
Electronics and PackagingLecture 39Lecture Notes6075 kb
Electronics and PackagingLecture 40Lecture Notes303 kb
Module NameDownload
Module NameDownloadDescriptionDownload Size
Introduction to Micro and Smart SystemsModule1 QuestionsQuestions for Module172 kb
Microfabrication processesModule2 QuestionsQuestions for Module292 kb
Mechanics of Slender SolidsModule3 QuestionsQuestions for Module3116 kb
Finite Element MethodModule4 QuestionsQuestions for Module4228 kb
Electronics and PackagingModule5 QuestionsQuestions for Module5144 kb

Sl.No Chapter Name English
1Glimpses of Microsystems: Scaling Effects PDF unavailable
2Smart Materials and SystemsPDF unavailable
3MicrosensorsPDF unavailable
4MicroactuatorsPDF unavailable
5Microsystems: some ExamplesPDF unavailable
6Smart systems Application and Structural Health MonitoringPDF unavailable
7Microfabrication TechnologiesPDF unavailable
8Thin-film Materials and their DepositionPDF unavailable
9Approaches for Pattern TransferPDF unavailable
10Surface Micromachining of MicrostructuresPDF unavailable
11Bulk Micromachining of MicrosystemsPDF unavailable
12Extended Approaches for Working MicrosystemsPDF unavailable
13Non-conventional Approaches for MicrosystemsPDF unavailable
14Packaging of MicrosystemsPDF unavailable
15Deformation Strains and StressesPDF unavailable
16Microdevice Suspensions: Lumped ModelingPDF unavailable
17Residual Stress and Stress GradientsPDF unavailable
18Torsion and TwistPDF unavailable
19Vibrations of Microsystems Devices: Part -1PDF unavailable
20Vibrations of Microsystems Devices: Part -2 Micromachined Gyroscopes: Part -1PDF unavailable
21Micromachined Gyroscopes: Part -2 Modelling of Coupled Electrostatic Microsystems: Part -1PDF unavailable
22Modelling of Coupled Electrostatic Microsystems: Part -2PDF unavailable
23Coupled Electrothermal-elastic ModellingPDF unavailable
24Modelling of Microsystems: Scaling EffectsPDF unavailable
25Finite Element Method and MicrosystemsPDF unavailable
26Theoretical Basis for the Finite Element MethodPDF unavailable
27Energy Theorems and Weak Form of the Governing EquationPDF unavailable
28Finite Element Equation Development and Shape FunctionsPDF unavailable
29Isoparametric FE Formulation and some ExamplesPDF unavailable
30Finite Element for Structures with Piezoelectric MaterialPDF unavailable
31Semiconductor Device PhysicsPDF unavailable
32BJT and MOSFET Characteristics and Op-AmpsPDF unavailable
33Op-Amp Circuits and Signal conditioning for Microsystems DevicesPDF unavailable
34Control and MicrosystemsPDF unavailable
35Vibration Control of a BeamPDF unavailable
36Signal Conditioning Circuits and Integration of Microsystems and MicroelectronicsPDF unavailable
37Pressure Sensor Design Concepts, Processing, and Packaging: Part -1PDF unavailable
38Pressure Sensor Design Concepts, Processing, and Packaging: Part -2PDF unavailable
39Pressure Sensor Design Concepts, Processing, and Packaging: Part -3 Capacitive Micro-accelerometer: Part -1PDF unavailable
40Capacitive Micro-accelerometer: Part -2PDF unavailable


Sl.No Language Book link
1EnglishNot Available
2BengaliNot Available
3GujaratiNot Available
4HindiNot Available
5KannadaNot Available
6MalayalamNot Available
7MarathiNot Available
8TamilNot Available
9TeluguNot Available