Modules / Lectures
Module NameDownload
noc19_me28_Assignment1noc19_me28_Assignment1
noc19_me28_Assignment2noc19_me28_Assignment2
noc19_me28_Assignment3noc19_me28_Assignment3
noc19_me28_Assignment4noc19_me28_Assignment4
noc19_me28_Assignment5noc19_me28_Assignment5
noc19_me28_Assignment6noc19_me28_Assignment6
noc19_me28_Assignment7noc19_me28_Assignment7
noc19_me28_Assignment8noc19_me28_Assignment8
noc19_me28_Assignment9noc19_me28_Assignment9

Sl.No Chapter Name English
1Lecture 1 : Introduction-1PDF unavailable
2Lecture 2 : Introduction-2PDF unavailable
3Lecture 3 : Introduction-3PDF unavailable
4Lecture 4 : Semiconductors and Components-1PDF unavailable
5Lecture 5 : Semiconductors and Components-2PDF unavailable
6Lecture 06: 1st Level Packaging- IPDF unavailable
7Lecture 07: 1st Level Packaging- IIPDF unavailable
8Lecture 08: Area Array Packages- IPDF unavailable
9Lecture 09: Area Array Packages- IIPDF unavailable
10Lecture 10: Area Array Packages- IIIPDF unavailable
11Lecture 11 : Flip Chip TechnologyPDF unavailable
12Lecture 12 : 1st Level Interconnections- IPDF unavailable
13Lecture 13 : 1st Level Interconnections- IIPDF unavailable
14Lecture 14 : 1st Level Interconnections- IIIPDF unavailable
15Lecture 15 : Advanced PackagingPDF unavailable
16Lecture 16: 2nd Level Packaging: PCB- IPDF unavailable
17Lecture 17: 2nd Level Packaging: PCB- IIPDF unavailable
18Lecture 18: 2nd Level Packaging: PCB- IIIPDF unavailable
19Lecture 19: 2nd Level Packaging: PCB- IVPDF unavailable
20Lecture 20: 2nd Level Packaging: PCB- VPDF unavailable
21Lecture 21: System IntegrationPDF unavailable
22Lecture 22: Thermal Management 1: IntroductionPDF unavailable
23Lecture 23: Thermal Management 2: ConceptsPDF unavailable
24Lecture 24: Thermal Management 3: Thermal ResistancePDF unavailable
25Lecture 25: Thermal Management 4: Heat SinkPDF unavailable
26Lecture 26 : Thermal Management 5: Heat Sink CharacterizationPDF unavailable
27Lecture 27 : Thermal Management 6: Heat Transfer CorrelationsPDF unavailable
28Lecture 28 : Thermal Management 7: Practice ProblemsPDF unavailable
29Lecture 29 : Thermal Mangement 8: Thermal TechnologiesPDF unavailable
30Lecture 30 : Thermal Management 9: Novel Cooling TechnologiesPDF unavailable
31Lecture 31: Shock and Vibration -1PDF unavailable
32Lecture 32: Shock and Vibration -2PDF unavailable
33Lecture 33: Shock and Vibration -3PDF unavailable
34Lecture 34: Shock and Vibration -4PDF unavailable
35Lecture 35: Electronic Packaging Reliability -1PDF unavailable
36Lecture 36: Electronic Packaging Reliability -2PDF unavailable
37Lecture 37: Electronic Packaging Reliability -3PDF unavailable
38Lecture 38: Electronic Packaging Reliability -4PDF unavailable
39Lecture 39: Power Electronics PackagingPDF unavailable
40Lecture 40: Special TopicsPDF unavailable


Sl.No Language Book link
1EnglishNot Available
2BengaliNot Available
3GujaratiNot Available
4HindiNot Available
5KannadaNot Available
6MalayalamNot Available
7MarathiNot Available
8TamilNot Available
9TeluguNot Available