Modules / Lectures
Module NameDownloadDescriptionDownload Size
Overview of electronic systems packagingLecture 1Lecture Notes498 kb
Overview of electronic systems packagingLecture 2Lecture Notes3326 kb
Overview of electronic systems packagingLecture 3Lecture Notes1775 kb
Overview of electronic systems packagingLecture 4Lecture Notes4120 kb
Overview of electronic systems packagingLecture 5Lecture Notes781 kb
Semiconductor Packaging OverviewLecture 6Lecture Notes1562 kb
Semiconductor Packaging OverviewLecture 7Lecture Notes2877 kb
Semiconductor Packaging OverviewLecture 8Lecture Notes3498 kb
Semiconductor Packaging OverviewLecture 9Lecture Notes2086 kb
Semiconductor Packaging OverviewLecture 10Lecture Notes2649 kb
Semiconductor PackagesLecture 11Lecture Notes2671 kb
Semiconductor PackagesLecture 12Lecture Notes1750 kb
Semiconductor PackagesLecture 13Lecture Notes4314 kb
Semiconductor PackagesLecture 14Lecture Notes2521 kb
Electrical Design considerations in systems packagingLecture 15Lecture Notes1789 kb
Electrical Design considerations in systems packagingLecture 16Lecture Notes2187 kb
Electrical Design considerations in systems packagingLecture 17Lecture Notes3080 kb
Electrical Design considerations in systems packagingLecture 18Lecture Notes261 kb
CAD for Printed Wiring BoardsLecture 19Lecture Notes2390 kb
CAD for Printed Wiring BoardsLecture 20Lecture Notes6857 kb
CAD for Printed Wiring BoardsLecture 21Lecture Notes8496 kb
CAD for Printed Wiring BoardsLecture 22Lecture Notes4689 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 23Lecture Notes7756 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 24Lecture Notes7388 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 25Lecture Notes4397 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 26Lecture Notes2814 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 27Lecture Notes1272 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 28Lecture Notes4512 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 29Lecture Notes2356 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 30Lecture Notes1247 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 31Lecture Notes1544 kb
Surface Mount TechnologyLecture 32Lecture Notes836 kb
Surface Mount TechnologyLecture 33Lecture Notes3265 kb
Surface Mount TechnologyLecture 34Lecture Notes2273 kb
Surface Mount TechnologyLecture 35Lecture Notes1106 kb
Surface Mount TechnologyLecture 36Lecture Notes2036 kb
Surface Mount TechnologyLecture 37Lecture Notes510 kb
Surface Mount TechnologyLecture 38Lecture Notes2795 kb
Thermal Design considerations in systems packagingLecture 39Lecture Notes300 kb
Embedded Passives TechnologyLecture 40Lecture Notes3462 kb
Embedded Passives TechnologyLecture 41Lecture Notes8234 kb
Conclusion and SummaryLecture 42Lecture Notes6881 kb
Module NameDownloadDescriptionDownload Size
CAD for Printed Wiring BoardsTest 1 mid-course (Test covers Modules 1-5)Test 1 mid-course (Test covers Modules 1-5). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries.172 kb
Surface Mount TechnologyTest 2 mid-course (Test covers Modules 6 and 7)Test 2 mid-course (Test covers Modules 6 and 7). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries.48 kb
Conclusion and SummaryFinal Exam (Examination covers all modules)Final Exam (Examination covers all modules). This is a timed-test for 3 hrs, complete the test and get back to the instructor for any queries.543 kb

Sl.No Chapter Name English
1Introduction and Objectives of the courseDownload
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2Definition of a system and history of semiconductorsDownload
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3Products and levels of packagingDownload
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4Packaging aspects of handheld products; Case studies in applicationsDownload
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5Case Study (continued); Definition of PWB, summary and Questions for reviewDownload
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6Basics of Semiconductor and Process flowchart; Video on Sand-to-SiliconDownload
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7Wafer fabrication, inspection and testingDownload
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8Wafer packaging; Packaging evolution; Chip connection choicesDownload
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9Wire bonding, TAB and flipchip-1Download
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10Wire bonding, TAB and flipchip-2; TutorialsDownload
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11Why packaging? & Single chip packages or modules (SCM)Download
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12Commonly used packages and advanced packages; Materials in packagesDownload
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13Advances packages (continued); Thermal mismatch in packages; Current trends in packagingDownload
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14Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packagesDownload
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15Electrical Issues : I; Resistive ParasiticDownload
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16Electrical Issues : II; Capacitive and Inductive ParasiticDownload
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17Electrical Issues : III; Layout guidelines and the Reflection problemDownload
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18Electrical Issues : IV; InterconnectionDownload
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19Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFTDownload
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20Components of a CAD package and its highlightsDownload
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21Design Flow considerations; Beginning a circuit design with schematic work and component layoutDownload
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22Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for ReliabilityDownload
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23Review of CAD output files for PCB fabrication; Photo plotting and mask generationDownload
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24Process flow-chart; Vias; PWB substratesDownload
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25Substrates continued; Video highlights; Surface preparationDownload
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26Photoresist and application methods; UV exposure and developing; Printing technologies for PWBsDownload
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27PWB etching; Resist stripping; Screen-printing technologyDownload
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28Through-hole manufacture process steps; Panel and pattern plating methodsDownload
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29Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microviasDownload
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30Microvia technology and Sequential build-up technology process flow for high-density interconnectsDownload
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31Conventional Vs HDI technologies; Flexible circuits; Tutorial sessionDownload
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32SMD benefits; Design issues; Introduction to solderingDownload
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33Reflow and Wave Soldering methods to attach SMDsDownload
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34Solders; Wetting of solders; Flux and its properties; Defects in wave solderingDownload
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35Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failuresDownload
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36SMT failure library and Tin WhiskersDownload
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37Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloysDownload
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38Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issuesDownload
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39Thermal Design considerations in systems packagingDownload
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40Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processesDownload
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41Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packagingDownload
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42Chapter-wise summaryDownload
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