Modules / Lectures
Module NameDownloadDescriptionDownload Size
Overview of electronic systems packagingLecture 1Lecture Notes498 kb
Overview of electronic systems packagingLecture 2Lecture Notes3326 kb
Overview of electronic systems packagingLecture 3Lecture Notes1775 kb
Overview of electronic systems packagingLecture 4Lecture Notes4120 kb
Overview of electronic systems packagingLecture 5Lecture Notes781 kb
Semiconductor Packaging OverviewLecture 6Lecture Notes1562 kb
Semiconductor Packaging OverviewLecture 7Lecture Notes2877 kb
Semiconductor Packaging OverviewLecture 8Lecture Notes3498 kb
Semiconductor Packaging OverviewLecture 9Lecture Notes2086 kb
Semiconductor Packaging OverviewLecture 10Lecture Notes2649 kb
Semiconductor PackagesLecture 11Lecture Notes2671 kb
Semiconductor PackagesLecture 12Lecture Notes1750 kb
Semiconductor PackagesLecture 13Lecture Notes4314 kb
Semiconductor PackagesLecture 14Lecture Notes2521 kb
Electrical Design considerations in systems packagingLecture 15Lecture Notes1789 kb
Electrical Design considerations in systems packagingLecture 16Lecture Notes2187 kb
Electrical Design considerations in systems packagingLecture 17Lecture Notes3080 kb
Electrical Design considerations in systems packagingLecture 18Lecture Notes261 kb
CAD for Printed Wiring BoardsLecture 19Lecture Notes2390 kb
CAD for Printed Wiring BoardsLecture 20Lecture Notes6857 kb
CAD for Printed Wiring BoardsLecture 21Lecture Notes8496 kb
CAD for Printed Wiring BoardsLecture 22Lecture Notes4689 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 23Lecture Notes7756 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 24Lecture Notes7388 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 25Lecture Notes4397 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 26Lecture Notes2814 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 27Lecture Notes1272 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 28Lecture Notes4512 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 29Lecture Notes2356 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 30Lecture Notes1247 kb
Printed Wiring Board Technologies: Board-level packaging aspectsLecture 31Lecture Notes1544 kb
Surface Mount TechnologyLecture 32Lecture Notes836 kb
Surface Mount TechnologyLecture 33Lecture Notes3265 kb
Surface Mount TechnologyLecture 34Lecture Notes2273 kb
Surface Mount TechnologyLecture 35Lecture Notes1106 kb
Surface Mount TechnologyLecture 36Lecture Notes2036 kb
Surface Mount TechnologyLecture 37Lecture Notes510 kb
Surface Mount TechnologyLecture 38Lecture Notes2795 kb
Thermal Design considerations in systems packagingLecture 39Lecture Notes300 kb
Embedded Passives TechnologyLecture 40Lecture Notes3462 kb
Embedded Passives TechnologyLecture 41Lecture Notes8234 kb
Conclusion and SummaryLecture 42Lecture Notes6881 kb
Module NameDownloadDescriptionDownload Size
Overview of electronic systems packagingQuizQuiz for Module 123 kb
Semiconductor Packaging OverviewQuizQuiz for Module 225 kb
Semiconductor PackagesQuizQuiz for Module 324 kb
Electrical Design considerations in systems packagingQuizQuiz for Module 420 kb
CAD for Printed Wiring BoardsQuizQuiz for Module 523 kb
Printed Wiring Board Technologies: Board-level packaging aspectsQuizQuiz for Module 626 kb
Surface Mount TechnologyQuizQuiz for Module 727 kb
Thermal Design considerations in systems packagingQuizQuiz for Module 820 kb
Embedded Passives TechnologyQuizQuiz for Module 923 kb


New Assignments
Module NameDownload
Module NameDownloadDescriptionDownload Size
CAD for Printed Wiring BoardsTest 1 mid-course (Test covers Modules 1-5)Test 1 mid-course (Test covers Modules 1-5). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries.172 kb
Surface Mount TechnologyTest 2 mid-course (Test covers Modules 6 and 7)Test 2 mid-course (Test covers Modules 6 and 7). This is a timed-test for 1 hr, complete the test and get back to the instructor for any queries.48 kb
Conclusion and SummaryFinal Exam (Examination covers all modules)Final Exam (Examination covers all modules). This is a timed-test for 3 hrs, complete the test and get back to the instructor for any queries.543 kb

Sl.No Chapter Name English
1Introduction and Objectives of the coursePDF unavailable
2Definition of a system and history of semiconductorsPDF unavailable
3Products and levels of packagingPDF unavailable
4Packaging aspects of handheld products; Case studies in applicationsPDF unavailable
5Case Study (continued); Definition of PWB, summary and Questions for reviewPDF unavailable
6Basics of Semiconductor and Process flowchart; Video on Sand-to-SiliconPDF unavailable
7Wafer fabrication, inspection and testingPDF unavailable
8Wafer packaging; Packaging evolution; Chip connection choicesPDF unavailable
9Wire bonding, TAB and flipchip-1PDF unavailable
10Wire bonding, TAB and flipchip-2; TutorialsPDF unavailable
11Why packaging? & Single chip packages or modules (SCM)PDF unavailable
12Commonly used packages and advanced packages; Materials in packagesPDF unavailable
13Advances packages (continued); Thermal mismatch in packages; Current trends in packagingPDF unavailable
14Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packagesPDF unavailable
15Electrical Issues : I; Resistive ParasiticPDF unavailable
16Electrical Issues : II; Capacitive and Inductive ParasiticPDF unavailable
17Electrical Issues : III; Layout guidelines and the Reflection problemPDF unavailable
18Electrical Issues : IV; InterconnectionPDF unavailable
19Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFTPDF unavailable
20Components of a CAD package and its highlightsPDF unavailable
21Design Flow considerations; Beginning a circuit design with schematic work and component layoutPDF unavailable
22Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for ReliabilityPDF unavailable
23Review of CAD output files for PCB fabrication; Photo plotting and mask generationPDF unavailable
24Process flow-chart; Vias; PWB substratesPDF unavailable
25Substrates continued; Video highlights; Surface preparationPDF unavailable
26Photoresist and application methods; UV exposure and developing; Printing technologies for PWBsPDF unavailable
27PWB etching; Resist stripping; Screen-printing technologyPDF unavailable
28Through-hole manufacture process steps; Panel and pattern plating methodsPDF unavailable
29Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microviasPDF unavailable
30Microvia technology and Sequential build-up technology process flow for high-density interconnectsPDF unavailable
31Conventional Vs HDI technologies; Flexible circuits; Tutorial sessionPDF unavailable
32SMD benefits; Design issues; Introduction to solderingPDF unavailable
33Reflow and Wave Soldering methods to attach SMDsPDF unavailable
34Solders; Wetting of solders; Flux and its properties; Defects in wave solderingPDF unavailable
35Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failuresPDF unavailable
36SMT failure library and Tin WhiskersPDF unavailable
37Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloysPDF unavailable
38Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issuesPDF unavailable
39Thermal Design considerations in systems packagingPDF unavailable
40Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processesPDF unavailable
41Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packagingPDF unavailable
42Chapter-wise summaryPDF unavailable


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2BengaliNot Available
3GujaratiNot Available
4HindiNot Available
5KannadaNot Available
6MalayalamNot Available
7MarathiNot Available
8TamilNot Available
9TeluguNot Available