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Course Co-ordinated by IISc Bangalore
Coordinators
 
Prof. K.N. Bhat
IISc Bangalore

 
Prof. G.K. Anathasuresh
IISc Bangalore

 
Prof. S. Gopalakrishnan
IISc Bangalore

 
Dr. K.J. Vinoy
IISc Bangalore

 

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Untitled Document
 

This interdisciplinary course not only gives an overview of the micro and smart systems technologies but also gives an in-depth understanding of the issues involved. It begins by answering the important question: why miniaturize? This is followed by a quick summary of a variety of sensors, actuators, and systems.

It then presents a comprehensive description of microfabrication. This is followed by a detailed discussion of mechanics of solids as it pertains to micro and smart systems.

While this part may be viewed as strength of materials and design, an effort is made to relate this to micro devices and discuss such topics as residual stress and stress gradients, lumped modeling using energy methods, anticlastic curvature, etc.

The discussion ends with general equations of elasticity and their solution is discussed next using the finite element method. Here, too the basics and advanced topics are interleaved to provide a thorough understanding of the finite element method. After this, electronics circuits, control, and packaging are also presented.

 

Lecture No.

Topic

  Module 1: Introduction

1.

Glimpses of Microsystems; scaling effects

2.

Smart materials and systems: an overview

3.

Microsensors: some examples

4.

Microactuators: some examples

5.

Microsystems: some examples

6.

Examples of smart systems: structural health monitoring and vibration control

 

Module 2: Microfabrication processes

7.

Structure of silicon and other materials

8.

Silicon wafer processing; Thin-film deposition

9.

Lithography, wet etching and dry etching

10.

Bulk micromachining and Surface micromachining

11.

Wafer-bonding; LIGA and other moulding techniques

12.

Soft lithography and polymer processing

13.

Thick-film processing; Low temperature co-fired ceramic processing

14.

Smart material processing

 

Module 3: Mechanics of Solids

15.

Stresses and deformation: bars and beams

16.

Microdevice suspensions: lumped modeling

17.

Residual stress and stress gradients

18.

Poisson effect; Anticlastic curvature; examples of micromechanical structures

19.

Thermal loading; bimorph effect

20.

Dealing with large displacements; in-plane and 3D elasticity equations

21.

Vibrations of bars and beams

22.

Gyroscopic effect

23.

Frequency response; damping; quality factor

24.

Basic micro-flows for damping calculation

 

Module 4: Finite element method

25.

Types of numerical methods for solving partial differential equations

26.

What is finite element method? Variational principles

27.

Weak form; shape functions

28.

Isoparametric formulation and numerical integration

29.

Implementation of the finite element method

30.

FEM for piezoelectrics

 

Module 5: Electronics and packaging

31.

Semiconductor devices: basics

32.

OpAms and OpAmp circuits

33.

Signal conditioning for microsystems devices

34.

Control and microsystems

35.

Vibration control of a beam

36.

Integration of microsystems and microelectronics

37.

Packaging of Microsystems: why and how

38.

Flip-chip, ballgrid, etc.; reliability

39.

Case-study 1 (Pressure sensor)

40.

Case-study 2 (Accelerometer)

  • Multi-variable calculus.


  1. S.D. Senturia, Microsustem Design, Kluwer Academic Publishers, 2001.

  2. Tai-Ran Hsu, MEMS & Microsystems Design and Manufacture, McGraw Hill, 2002.

  3. V.K. Varadan, K.J. Vinoy, and S. Gopalakrishnan, Smart Material Systems and MEMS: Design and Development Methodologies, Wiley, 2006.



  1. G.T.A. Kovacs, Micromachined Transducers Sourcebook, WCB McGraw-Hill, 1998.

  2. J.W. Gardner, Microsensors: principles and applications, John Wiley & Sons, 1994.

  3. M. Madou, Principles of Microfabrication, CRC Press, 1998.



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